Supplementary Material
FGF-500
Free Grounding Film
FGF-500 is a supplementary material to connect Ground joint on a top of TATSUTA Shielding film. In general, multiple Ground joint points on a flexible circuit board, it is possible to connect the outside ground such as a steel case or metallic frame, and support lead free solder.
- Can take Ground joint on a top of TATSUTA EMI Shielding film freely
- Total thickness, 12 um
- Keep stable Joint resistance by Au plating