Copper Bonding Wire
Copper Bonding Wire
Tatsuta's copper bonding wires are the result of the expertise and years of experience we have gained as a manufacturer of electric cable and gold bonding wire. Our copper bonding wire integrates extensive improvements from more than 99.9999% pure (6N) copper and more than 99.99% oxygen-free (4N) copper. We produce our copper bonding wire in an integrated manufacturing system that encompasses all steps from raw material procurement to completion of the finished product and includes a stringent quality control system.(ISO9001certification：JQA-0680, ISO14001certification：JQA-EM2078)
TC-A Series: High-Purity Copper Type
- Copper has a lower cost than gold.
- Copper wire offers superior long-term reliability compared to gold wire. It is suitable for automotive ICs.
- Copper wire’s electroconductivity is superior to that of gold wire. Copper wire exhibits good heat release and is ideal for use in high-speed ICs.
- The initial ball is soft and the use of high-purity (6N) copper as a source contributes to damage-resistant chips.
- Excellent second and subsequent bonding results from the oxygen-free (4N) copper characteristic.
TC-E Series: Oxygen-Free Copper Type
- This material is lower-cost than high-purity (6N) copper for superior cost effectiveness.
- The squashed ball shape offers superior wire strength and circularity compared to high-purity (6N) copper.
- Offers long-term reliability superior to that of gold wire. It is suitable for use in automotive ICs.
- Offers superior electroconductivity compared to gold wire. Copper wire exhibits good heat release and is ideal for use in high-speed ICs.
Copper Bonding Wire(TC-A)
[Loop Appearance]
![[Loop Appearance]](img/tca_sub_img01.jpg)
- Bonding Wire Product line
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Gold Bonding Wire
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Copper Bonding Wire
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Gold Bumping Wire