Gold Bumping Wire
Gold Bumping Wire
Tatsuta's gold bumping wire products are the result of the extensive experience and technology we have gained from the manufacture of gold bonding wire. As a result, we have combined stable bump formation with high-purity gold.(ISO9001certification：JQA-0680, ISO14001certification：JQA-EM2078)
TG-Xb Series: Gold Bumping Wire
- Resistant to chip damage. High-purity gold ensures stable bump formation.
- Suitable for bumps on flip chip packages.
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- Bonding Wire Product line
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Gold Bonding Wire
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Copper Bonding Wire
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Gold Bumping Wire