For via filling
Non-conductive copper paste for via filling
AE1125 series
AE1125 series is Non-conductive copper paste for via filling that can make High-Density Interconnect (HDI) PCB. Copper particles work as anchors of copper cap plating and give the stronger peeling strength to copper cap plating than resin type. It can be made the copper cap plating thinner (Min. 5 μm) and save the cost of plating from this effect. It is also the good material for Pad on Via and Via on Via design which are required severe reliabilities.
It has been widely used various applications ;
Actual applications
· Automobile : ECU, Navigation systems etc
· Telecommunication : Mobile phone
· Electronics equipments : Digital camera, LCD-TV, Blue-ray recorder
| AE1125DS | Long Shelf life, High Tg |
| AE1125HD | Standard type, Long life |
- Void less
- Flat and smooth surface (After reliability test : within ± 5 μm)
- Strong peeling strength to cap copper plating
- Tg(DMA) : DS：210oC、HD:163oC
- Low CTE : DS : α1= 44ppm, α2= 80ppm , HD : α1= 36ppm, α2= 83ppm
- Thermal conductivity : 1 – 1.5 W/mK
- Halogen free
- Conductive paste Product line
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For via filling
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For through-hole