For via filling
Conductive paste for via filling
AE2217 / AE1244
AE1244 is a conductive copper paste for via filling to non-copper plating via holes that can make High-Density Interconnect (HDI) PCB. It has good conductivity and it can be plated direct by Nickel / Gold without copper plating on it. It is also the good material for Pad on Via and Thermal Via that are required severe reliabilities.
It has been widely used various applications ;
Actual applications
· Microphone, LED module, LED back light, CCD camera module,
Wireless LAN, High frequency module etc
- Void less
- Flat and smooth surface (After reliability test : within ± 5 μm)
- Strong peeling strength to cap copper plating
- Tg (DMA) : 110 oC
- Low CTE : α1= 54ppm, α2= 103ppm
- Thermal conductivity : （AE2217：13.5W/mK , AE1244：11.7W/mK）
- Volume resistivity : 5 x 10-5 Ωcm
- Direct Nickel and Gold (except copper plating) plating can be applicable
- Halogen free
- Conductive paste Product line
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For via filling
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For through-hole