For via filling

Conductive paste for via filling

AE3030

  • RoHS
  • Pb Free Reflow
  • Registered Sony Green Book
  • Halogen Free

AE3030 is a conductive copper paste for via filling to copper plating via holes that can make High-Density Interconnect (HDI) PCB. It has good adhesion to the copper plating in via holes and high Tg. It is also the good material for Pad on Via and Via on Via design which are required severe reliabilities. It has been widely used various applications ;

Actual applications
· Aerospace, LED module, Server, Router, High frequency module

  • Void less
  • Flat and smooth surface (After reliability test : within ± 5 μm)
  • Strong peeling strength to cap copper plating
  • Tg (DMA) : 171 oC
  • Low CTE : α1= 40ppm, α2= 86ppm
  • Thermal conductivity : 7.8 W/mK
  • Volume resistivity : 2 x 10-4 Ωcm
  • Halogen free
Inquiries about Conductive paste
Conductive paste Product line
For via filling
For through-hole
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