Bonding wire is an integral part of the semiconductor package structure. TATSUTA takes advantage of its long years of experience in copper wire drawing technology to provide cost effective solutions for the mainstream copper, gold and silver bonding wire needs of recent years. However, TATSUTA does not stop there, as we work to create new, groundbreaking products that will contribute to the growth and development in electronics over a broad spectrum.
Gold Wire / Gold Bumping Wire
- Microsize wire technology to fight rising gold prices
TATSUTA has been proudly manufacturing semiconductor gold wire for 30 years. Thanks to the quick response of TATSUTA’s sales and manufacturing team and our precision engineering service, leading Japanese manufacturers prefer our gold wire, using it in a diverse range of electronic devices.
- Bonding Wire Designed to Take Advantage of the Unique Characteristics of Silver
The IC and LED markets have dramatically increased their use of silver wire in recent years. Silver wire helps increase light intensity in LED applications and this has created rising expectations for its future.
- Cost saving alternative to gold wire
The recent sharp rise in gold prices has led to a full-scale spread of lower cost copper wire, mainly outside of Japan. TATSUTA has taken on the challenge of developing copper wire for increasingly sophisticated and complicated applications. Mainly in automotive applications, use of TATSUTA copper wire is growing, from small pin count discrete packaging to high pin count ICs.
Palladium - Copper Wire
- New wire grade with the advantages of both gold and copper
Palladium coated copper wire is a new grade which is lower in cost than gold wire and allows a broader range of production control.
- For inquiries about Bonding Wire