TATSUTA Electric Wire & Cable Co., Ltd.

Business Units

Gold Wire / Gold Bumping Wire

Developed from long years of experience and technology as a wire manufacturer

Using a base of highly pure gold and using processes from casting to wire drawing, annealing, and rewinding, TATSUTA’s integrated manufacturing system incorporates innovation and technology we have developed under a system of strict quality control.

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Product information

High Loop TypeTG-S Series
  • High loops easily formed, restricting short circuits at a chip edge.
  • Highly resistant to neck damage and wire breakage caused by vibration.
  • Softness of wire allows for a cleanly shaped loop.
  • Suitable for power ICs with thick wires.
Medium Height Loop TypeTG-U Series
  • Although very strong, the wire is also able to provide a high loop with excellent resistance to wire sweep.
  • Highly resistant to neck damage and wire breakage caused by vibration.
  • This versatile gold bonding wire can be used in a wide range of packaging applications from low to high pin count.
Low Loop TypeTG-X Series
  • The stability and high strength of the low loop provide high resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packaging subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packaging with high pin counts and long loop bonding.
Long Loop TypeTG-V Series
  • The stability and high strength of the low loop provide high resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packaging subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packaging with high pin counts and long loop bonding.
Ultra-low / Long Loop Types TG-L Series
  • The stable formation and high strength of the ultra-low loops ensure excellent resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Smaller crystals at the ball neck region provide extremely high resistance to neck damage.
  • The stable roundness of the ball bond makes it suitable for fine pitch bonding.
  • Suitable for slimline packaging such as BGAs and stacked CSPs with high pin counts.
TG-L1
Ball formation
Short loop
TG-L2
Long loop
Relationship between Breaking Load and Loop Height (25μm)
Bumping WireTG-B/RB Series
  • Pre-cut for stable bump height
  • Enables high speed formation of bump
  • Enables stable bump formation in flip chip applications
bump bump zoom up
For inquiries about Bonding Wire
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