TATSUTA Electric Wire & Cable Co., Ltd.

Business Units

Functional Materials

Product Information

Via Filling Paste

Highly conductive type DD paste AE2217 / AE1244 / AE3030
  • Superior heat resistance
  • Volume resistivity (1.0×10-4Ω・cm)
  • No voids
Download document
Product Catalog
SGS
Test Report: AE2217
Test Report: AE1244
image
High heat resistance type (Non-conductive) DD paste AE1125DS / AE1125HD
  • Superior heat resistance.
  • No voids
  • Superior reliability of cap plating
Download document
Product Catalog
SGS
Test Report: AE1125DS
Test Report: AE1125HD
image
Metallized type (melted metal type) MPA500
  • Alloying with copper foil creates high connecting reliability
  • Superior thermal conductivity (heat transfer loss at interface reduced by alloying)
  • Superior conductivity (1.0×10-4Ω・cm)
image

Copper Paste for Shielding applications

For EMI Countermeasure and Crossover PCB applications DD paste NF2000EX
  • Superior conductivity (1.0×10-4Ω・cm)
  • Better migration resistance than silver paste.
  • Superior cost performance
Download document
Product Catalog
SGS
Test Report
image

For Interconnection Fabrication applications

Conductive Paste SW150
  • Because of its low temperature curing, it is applicable for various base materials, from PET base materials to FR4, PI base materials
  • Can be used as a plating shield layer (copper, tin, nickel or other plating)
  • Superior adhesion to various materials
image
For inquiries about Functional Materials
TOP