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Gold Bonding Wire

Gold Bonding Wire

Tatsuta has applied its years of experience and achievements as a manufacturer of electric cable to the development of gold bonding wire. This Products incorporates the extensive improvements achievable with 99.999% pure gold, including casting, wire drawing, refining, rewinding, and developmental technologies. Tatsuta's gold bonding wires are produced with an integrated manufacturing system that handles every step — from procurement of raw materials to completion of the finished Products — under a stringent quality control system. What’s more, to ensure our Products meet the demand for exceptional reliability demanded by the semiconductor industry, we manufacture, inspect, and package our bonding wires in clean rooms. We remain committed to meeting customer expectations while striving for continual quality improvement.
(ISO9001certification：JQA-0680, ISO14001certification：JQA-EM2078)

TG-S Series: High-Loop Type

  • Easily forms a high loop and is least likely to be short-circuited at the edge of a chip.
  • Resistant to damage at the neck region, disconnection, and breakdown caused by vibration.
  • Soft wires make possible an attractive loop.
  • Suitable for the thick wires of power ICs.

TG-U Series: Medium-height loop type

  • Provides a high loop while maintaining high strength and excellent resistance to wire sweep.
  • Resistant to damage at the neck region, disconnection and breakdown caused by vibration.
  • Versatile gold bonding wire accommodates a wide variety of applications requiring a large or small number of pins.

TG-X Series: Long-Loop Type

  • The stable formation and high-strength of low loops exhibit superior resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packages subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packages with large numbers of pins and long loop bonding.

TG-V Series: Long-Loop Type

  • The stable formation and high strength of low loops ensure excellent resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Suitable for TSOP, TQFP, and other slimline packages subject to thickness restrictions.
  • Suitable for QFN, QFP, and other packages with large numbers of pins and long loop bonding.

TG-L Series: Ultra-Low and Long-Loop Types

  • The stable formation and high strength of the ultra-low loops ensure excellent resistance to wire sweep.
  • High heat resistance ensures excellent temperature cycling characteristics.
  • Small crystals at the ball neck region provide extremely high resistance to damage at the neck region.
  • The stable circularity of the squashed ball shape is suitable for fine pitch bonding.
  • Suitable for slimline packages such as BGA and stacked CSP with large numbers of pins.

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Gold Bonding Wire(TG-L1)
[Ball Formation] [Short Loop]
Ball Formation Short Loop
Gold Bonding Wire(TG-L2)
[Long Loop]
Long Loop
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