R&D
| As the electronics industry develops and a highly systematized society extends, required performance for electronics equipments and electronics components & materials becomes sophisticated and highly diversified. Our company has been developing products in the electronics component & material field based on various technologies we acquired in electric wire & cable business over the years, including metal material technology, high-polymer material technology, material design technology and thin film coating technology. Under the slogan of “The New Challenge”, we aim to become “The Only One Company” in the electronics component & material field. We are the engineer group that sees metal materials and high-polymer materials from a new perspective, establishes unique architecture, casting and processing method and develops nonconventional and revolutionary electronics materials. We will create a new frontier with the integration of existing technology and our technology, thus we always try to get an inspiration by looking for a necessity for new technology and thinking about the possibilities brought about by combining several existing technologies. |
Functional film divisionFPC (flexible printed circuit) is a film circuit board or circuit and contact sheet. Its characteristics, thin, lightweight and flexible allow it to contribute to size reduction and high advancement in functionality of all electronics equipments in recent years. Our company develops high-flex shielding film materials for FPC that withstand hundreds of thousands of flex cycles and isotropic conductive bonding films that employ metal particle with high conductivity. And also we work hard on R&D of basic technologies that open a new age. Those technologies include halogen-free materials that reduce the impact on the environment and circuit connection materials for touch panel by utilizing advanced processing technology because this material is drawing a lot of attention in a ubiquitous computing society, as an essential technology. |
Paste divisionAs electronics equipments become smaller and lighter, density of mounting on board circuit is getting higher and higher. In order to contribute to the development in this area, we will pioneer a new field in paste technology by putting new ideas and concepts into conventional metal particle technology and dispersion technology. We already commercialized filling paste for high density wiring and copper paste for through-hole. We also work on other areas that are expected to see increasing demand, including lead-free solder-substituting paste, thermal releasing paste for LED light-emitting element cooling. |
Bonding wire divisionBonding wire has long been used, as an essential material for semiconductor, contributing to the development of electronics equipments. We have abundant expertise and experience of many years, as an electric cable manufacturer. So we try to apply that expertise in the development of gold-bonding wire and copper-bonding wire under an integrated manufacturing system in which we are responsible for every step from casting, wire drawing, refining to rewinding. We will challenge the development of gold-bonding wire and copper-bonding wire that satisfy the rising demand of our customers by combining production technology and metal material technology we accumulated for many years. |