Conductive bonding film, thermosetting type for FPC applications CBF®-300/-W6

CBF-300 is a thermosetting conductive bonding film, which can use a laminating metallic reinforcing plate to function as a shielding layer by making an electrical connection with the GND circuit of FPCs.
Features
- Superior level of high conductivity properties (stronger grounding)
- Superior high shielding performance within a wide frequency range
- Superior adhesion to various materials
Registered UL component
UL94 HB (combined with Kapton 50H) Kapton is a registered trademark of Dupont, a US company
Environmental regulation compliance
UL94 flame class | HB |
---|---|
Environmental regulations | Halogen-free, RoHS Directive, lead free solder reflow |
Download document
- For inquiries about products