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Conductive bonding film, thermosetting type for FPC applications CBF®-300/-W6

CBF®-300/-W6

CBF-300 is a thermosetting conductive bonding film, which can use a laminating metallic reinforcing plate to function as a shielding layer by making an electrical connection with the GND circuit of FPCs.

Features

  • Superior level of high conductivity properties (stronger grounding)
  • Superior high shielding performance within a wide frequency range
  • Superior adhesion to various materials

Registered UL component

UL94 HB (combined with Kapton 50H) Kapton is a registered trademark of Dupont, a US company

Environmental regulation compliance

UL94 flame class HB
Environmental regulations Halogen-free, RoHS Directive, lead free solder reflow

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