Free grounding film for shielding film FGF®-500
FGF-500 is an auxiliary material used to form ground electrodes on the surface of our EMI shielding films for FPCs by connecting to the frame ground or chassis ground via a gasket or the like. Using FGF-500 increases the design freedom and enables higher density.
Features
- Ensures grounding connection at a location on the shielding film of the user’s discretion
- Enables even higher density wiring on circuit board
- Makes it possible to use a multilayer structure in the grounding connection area (total thickness 12µm)
Registered UL component
UL94 V-0 (combined with Kapton 50H) Kapton is a registered trademark of Dupont, a US company
Environmental regulation compliance
| UL94 flame class | V-0 |
|---|---|
| Environmental regulations | Halogen-free, RoHS Directive, lead free solder reflow |
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