Via-filling paste (Non-conductive type) AE1125DS/AE1125HD
The non-conductive via filling pastes are used for a wide range of PWBs. Electrically stable insulation is secured by applying a special treatment to the surfaces of copper particles. This series does not contain solvents, enabling void-less filling. The products have been received good reputations in consumer electronics, industrial and automotive products for over the years.
Product details
Applications
| PCB for industrial/automotive | PCB for consumable goods |
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Product lineup
| Product name | AE1125HD | AE1125DS | ||
|---|---|---|---|---|
| Viscosity | BH type | dPa·s | 1,200-2,000 | 800-1,600 |
| Curing conditions | Pre-curing | 80°C / 30 min | ||
| Curing | 160°C / 60 min | |||
| Volume resistivity | Ω·㎝ | 1.0E+09-1.0E+12 | ||
| Thermal conductivity (Laser flash method) | W/m·k | 1.4 | 1.1 | |
| Glass transition temperature | °C | 163 | 210 | |
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